The project addresses interlayer cooling of 3D computer chips, including water cooling, two-phase refrigerant cooling, development and perfection of new micro-fabrication techniques for TSVs and their connections, bonding of stacked layers together, dynamic thermal modeling of 3D chips, and extensive experimental testing of2D and 3D cooling solutions and new thermal models.
Soft iron/silicon composite tubes for magnetic peristaltic pumping: Frequency-dependent pressure and volume flow R. Fuhrer, C.M.Schumacher, M. Zeltner, and Wendelin J. Stark Advanced Functional Materials
Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks A. Vincenzi, A. Sridhar, M. Ruggiero and D. Atienza Alonso 22nd edition of Great lakes symposium on VLSI (GLSVLSI2012)
Development and characterization of custom-engineered and compacted nanoparticles as calibration materials for quantification using LA-ICP-MS Daniel Tabersky, Norman A. Luechinger, Michael Rossier, Eric Reusser, Kathrin Hametner, Beat Aeschlimann, Daniel A. Frick, Samuel C. Halim, Jay Thompson, Leonid Danyushevskyd and Detlef Günther Journal of Analytical Atomic Spectrometry
Synthesis of Trisubstituted Ureas by a Multistep Sequence Utilizing Recyclable Magnetic Reagents and Scavengers Quirin M. Kainz, Martin Zeltner, Michael Rossier, Wendelin J. Stark, and Oliver Reiser Chemistry : a European journal
